Theobroma Systems announces next generation of modules based on the Rockchip RK33-series
Theobroma Systems has selected Rockchip’s RK33-series of application processors to power its next generation of 64bit ARM modules aimed at machine vision, robotics, IoT gateways, human machine interface solutions and general embedded applications. The new RK3399-Q7 and RK3368-uQ7 modules redefine performance and functionality of embedded processor modules.
The RK3399-Q7 is the new flagship product, combining best-in-class performance with a rich set of peripherals in a 70mm-by-70mm module:
⁃ 2 CPU clusters in a Big.Little configuration with advanced power-management and dynamic frequency scaling
⁃ dual-core ARM Cortex-A72 MPCore (up to 2.0GHz)
⁃ quad-core ARM Cortex-A53 MPcore (up to 1.42GHz)
⁃ ARM Trustzone
⁃ ARM Mali T-860MP4 GPU
⁃ 2 channels (32bit each) of DDR3-1600 with (up to) 4GB
⁃ video encoding and decoding
⁃ decodes all common codecs, including H.265 and VP9, up to 2160p60
⁃ encodes H.264 in 1080p30
⁃ 2 independent camera sensor interfaces (MIPI-CSI)
⁃ video output as HDMI, Displayport, eDP and MIPI-DSI channels
⁃ high-performance Gigabit Ethernet controller
⁃ 2 USB 3.0 ports and 2 USB 2.0 ports
⁃ PCI-Express v2.1 w/ 4-lanes
The mid-range RK3368-uQ7 module, which is designed to offer an easy upgrade path from our entry-level A64-uQ7 offering, will be the first 8-core Cortex-A53 module compatible with the 40mm-by-70mm micro-Qseven form-factor.
“By building our next generation of 64bit ARM-based system-on-modules with Rockchip’s RK3399 and RK3368 application processors, we will enhance our product lineup for industrial customers by offering the interfaces most requested for next-generation industrial applications. We can now offer USB 3.0, multiple independent MIPI-CSI interfaces, up to 3 concurrent displays and PCI-Express—all backed by our own in-house software support for Linux and Android,” explains Dr. Philipp Tomsich, Chief Technology Officer of Theobroma Systems, the key benefits of the new products to customers.
“Rockchip solutions have been widely used in industrial segment, but with the increasing demand from industrial customers for accelerating time-to-market and reducing development costs and risks meantime, we see more customers looking for system-on-module partner to help them in product development. The collaboration between Rockchip and Theobroma Systems will enable our customers to achieve high quality products with faster design cycles and a lower development cost. As Rockchip important local SoM partner in Vienna, Theobroma Systems will provide one-stop-shop service by offering RK3399-Q7 and RK3368-uQ7 module and Software support at the same time.” says Feng Chen, Senior Vice President of Rockchip.
The RK3399-Q7 will ship to early-access customers in the first quarter of 2017 and is supported by Linux and Android.
Additional press material:
About Theobroma Systems
Theobroma Systems is a leading provider of embedded systems solutions for industrial and high-assurance applications. Theobroma Systems provides engineering services and turnkey system-on-module designs, accelerating time-to-market and reducing project risk for customers.
Key contributions from Theobroma Systems that redefined the state-of-the-art for embedded modules include:
• the world’s first family of processor modules featuring an EAL4+ certified, “government-grade” security module
• the world’s first 64bit ARM module with 10GbE connectivity (HeliX2-COMExpress)
• the world’s first 64bit ARM module in a micro-Qseven form-factor (A64-uQ7)
The company is located in Vienna, Austria. www.theobroma-systems.com.
Rockchip is China’s leading fabless semiconductor company and has been honored with China Chip Awards for 9 times.
Being a premium end-to-end SoC solution provider for Tablet, OTT-Box, ARM PC, In-vehicle devices, VR, Robot, Drone, IoT, Image processing, Multi-media audio&video products and Embedded industry application, Rockchip is committed to providing more competitive solutions to fuel successful growth for our customers today and in coming future.
With headquarter based in Fuzhou, Rockchip has established R&D centers in Shanghai, Beijing and Shenzhen respectively.